Thermal Conductive Potting Glue

Thermal conductive potting glue is a two-component polyurethane potting material with excellent electrical properties, no corrosion to electrical components, and good adhesion to metals such as steel, aluminum, copper, tin, and materials such as rubber, plastic, PET, PVC, and PC.

The cured potting material can protect the installed and debugged electronic components and circuits from vibration, corrosion, moisture, and dust.

Use evenly mixed glue for potting (vacuum potting is best if possible), and use up the mixed glue as soon as possible, otherwise the increase in glue viscosity may affect the curing effect.
Features and Advantages

Thermal conductivity of Feihongda thermal potting glue: 0.6-3W/mk

Low viscosity, easy operation, aging resistance, acid and alkali resistance, corrosion resistance and other reliability

Excellent adhesion to metals, plastics, PET, PVC, PC and other materials

Minimal internal stress, little damage to devices, protect electronic components

UL94 V-0 flame retardant, meets RoHS environmental protection requirements

Customization information

Specifications: 400ML/200L/customized specifications

Color: black, dark brown

Application

Suitable for potting of various electronic components and electronic modules.

< Application diagram of thermal conductive sealant for electronic components >