There are many power devices inside electronic equipment, and each device is an independent conductor with its own resistance. When voltage is applied to the conductor, free electrons begin to move and generate current. As these free electrons flow through the conductor, they collide with the atomic particles of the conductor material, causing friction. This results in not only the operating power of the device itself but also additional thermal power, which is the "heating" phenomenon commonly seen in electronic devices.

The devices that generate the highest rate of thermal energy in modern electronic equipment include light-emitting diodes (LEDs) and central processing units, such as GPUs, CPUs, and TPUs. Voltage-changing devices like transformers, resistors, converters, and inverters also release significant amounts of thermal energy. Therefore, keeping power devices at an appropriate operating temperature helps them perform optimally and maintain greater long-term reliability.

The heat dissipation methods of electronic devices are divided into active and passive cooling. Active cooling involves external energy intervention, such as air cooling or water cooling, to carry heat away. Passive cooling, on the other hand, relies on heat sinks, heat pipes, thermal conductive materials, and other components to improve the thermal conductivity of the parts themselves and transfer heat, without the need for external energy, making it more economical and environmentally friendly. Typically, the thermal conductivity of thermal conductive materials is over 100 times that of air!

Feihongda Technology is professional and focused on the research, development, and production of thermal conductive materials, providing solutions for various thermal conduction and heat dissipation problems.