Thermal HF4000 Thermal phase change material is a new type of material composed of thermal conductive filler and resin-type phase change compound, which is specialized for the heat transfer interface between power consumption devices and heat sinks.
Thermal HF4000 Thermal phase change material is a new type of material composed of thermal conductive filler and resin-type phase change compound, which is specialized for the heat transfer interface between power consumption devices and heat sinks.
Thermal HF4000 transforms from a solid to a mushy liquid at 52 ° C. Thus ensuring that the surface of the power consumption device and the radiator is fully wet, producing the lowest thermal resistance and forming an excellent thermal conductivity channel, so that the radiator can achieve the best heat dissipation performance, thereby improving the reliability of the CPU, graphics accelerator, DC/DC power module and other power devices.
Thermal HF4000 thermal phase change material can be preformed for device installation like thermal conductive sheet, and has low thermal resistance characteristics like silicone grease, which combines the perfect characteristics of the two.
