Product Introduction

F200S-B61 has good insulation, pressure resistance, flexibility and excellent thermal conductivity. The surface has natural tack, which can fill the gap and squeeze out the air between the heat source and the radiator to achieve full contact and effectively improve the heat transfer efficiency. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent thermally conductive filler material and is widely used in various electronic components.

Typical applications

Between heat-generating semiconductors and a heat sink
Between heat-generating magentic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Telecommunications, Computer and peripherals, Power conversion, Consumerelectronics

Features and advantages

Low thermal impedance Electrically isolating Comfortable gap filling material Natural tack for easy assembly Thermal conductivity : 2.0 W/mK Designed for low-stress applications Enhanced puncture, shear and tear resistance

Thermal Interface Materials

Conductive Material

Microwave Absorber

Adhesive Material

Product Introduction

Typical applications

Features and advantages