Thermally conductive phase change material

Thermally conductive phase change material is a new type of material made of nano-grade high thermal conductive filler and phase change compound, and coated on both sides of thermal conductive PI film. It is used for the heat transfer interface between power-consuming devices and radiators.Phase change occurs at 52°C, from solid to liquid. Liquid thermally conductive phase change materials can fully wet the surface of power-consuming devices and heat sinks, forming an excellent heat conduction channel between them. Thermally conductive phase change materials can enable the heat sink to achieve optimal heat dissipation performance, thereby enhancing the reliability of power devices.

The initial state of this material is solid. After heating, it can melt and become liquid. When the temperature drops, it turns back to a solid state. Therefore, it is called a thermal conductive phase change material.

Features & Benefits
Fehonda thermally conductive phase change materials have a thermal conductivity of 2.2-4W/mK.
Phase change from solid state to liquid state occurs at 52°C.
Low thermal resistance, excellent thermal conductivity and heat dissipation,great reliability
UL94 V-0, Comply with RoHS environmental protection requirements

Customization Information
It can be die-cut into different shapes and specifications according to customer requirements.

Application Scenario

Thermally conductive phase change materials are widely used in power modules, display chips, consumer electronics, mobile phones, IGBT devices, and memory modules.